Hardware

What to connect between your MCU and a TLE92466ED, with which bus settings and supplies, and the board-level details that decide whether the first frame works.

All values here come from the TLE92466ED datasheet (Rev. 1.2, 2022-02-01). When they disagree with a board's schematic, the schematic wins for pin routing and active levels.

Host interface pins

Signal (pin)	Direction	Notes
CSN (5)	in	Active low; internal pull-up
SCK (6)	in	Internal pull-down
SI (7)	in	MOSI; internal pull-down
SO (9)	out	MISO, push-pull at VIO; tri-state while CSN is high
VIO (8)	supply	The MCU's I/O rail, 3.3 V or 5 V

The SPI inputs accept 3.3 V or 5 V logic (V_IH 2 V maximum, V_IL 0.8 V minimum); the pull-up and pull-downs are 10 µA to 50 µA. SO tri-states within 200 ns after CSN rises, so the chip can share a bus with other devices.

Control pins

The driver addresses RESN, EN and FAULTN by name (tle92466ed::CtrlPin) and by state (GpioSignal::ACTIVE / INACTIVE). Your port maps a state to a level, so the same driver code works with inverted or level-shifted signals.

Pin (number)	Direction	What it does	Driver use
RESN (26)	in, active low	Resets every register, all channels off	Pulsed by Init(); HoldReset(), ReleaseReset()
EN (27)	in, active high	Enables the outputs; SPI works when low	Set by Init(); Enable(), Disable()
FAULTN (11)	open drain, active low	Signals a fault; usable as an interrupt	IsFault(); pull it up to VIO
DRV0, DRV1 (25, 28)	in	Drive channels in DIRECT_DRIVE_DRV0/1	Not driven by the driver
CLK (24)	in	External PLL clock, 1 MHz to 8 MHz	ConfigureClockSource()

FAULTN sinks 2 mA at 0.4 V maximum; leave it open if you do not use it. The PLL runs from the internal oscillator or, with EXT_CLK set in CLK_DIV, from CLK; f_SYS is 28 MHz either way (27.5 MHz to 28.5 MHz).

Power stage pins

Channel	LOADx	FWDx	GNDPx
CH0	1	2	3
CH1	18	17	16
CH2	19	20	21
CH3	36	35	34
CH4	31	32	33
CH5	13	14	15

GND is pins 4, 10, 12, 23 and 30, and the exposed cooling tab. Connect every GNDPx to GND externally and the tab to GND and the heat-sink copper.

Load connection

Each channel is a low-side switch: connect the load between its supply and LOADx. The current flows through the internal shunt and the DMOS to GNDPx while the channel is on.

Inductive loads need the freewheeling diode at FWDx

The chip has no internal freewheeling diode. For a solenoid or valve, fit a diode from FWDx (anode) to the load supply (cathode), as the datasheet's application diagram (section 6) shows. Without it the coil current has no path when the switch opens, and the measured average current is wrong.

The datasheet recommends 4.7 nF to 10 nF ceramic capacitors at the load connector and at FWDx. Channels CH0/CH3, CH1/CH2 and CH4/CH5 can be wired in parallel for one load: connect both LOAD pins to the load and both FWD pins to the diode, and configure the pair as described in Current control.

Bus settings

Setting	Value
Mode	SPI mode 1 (CPOL = 0, CPHA = 1): SI sampled on the falling SCK edge, SO shifted on the rising edge
Bit order	MSB first, both directions
Frame	Exactly 32 bits per CSN low period; any other length is ignored
Speed	Up to 8 MHz (fSCK); the examples run at 1 MHz
Integrity	CRC-8 SAE J1850 in bits [31:24] of every frame (SPI protocol)
Reply	Clocked out during the next frame
Watchdog	Optional SPI watchdog: reload WD_RELOAD before it reaches 0 (Diagnostics)

Timing

Parameter	Limit	Meaning
SCK high, low (tSCKH, tSCKL)	≥ 50 ns	8 MHz maximum clock
Enable lead (tCSN_LEAD)	≥ 250 ns	CSN falling to the first SCK rising edge
Enable lag (tCSN_LAG)	≥ 250 ns	Last SCK falling edge to CSN rising
Transfer delay (tCSN_TD)	≥ 600 ns	CSN high time between two frames
SI setup, hold (tSI_SU, tSI_H)	≥ 20 ns	Around the falling SCK edge
SO valid (tSO_V)	≤ 100 ns	150 pF load
SO enable, disable (tSO_EN, tSO_DIS)	≤ 200 ns	From CSN falling, rising
Reset to logic ready (tRESN)	≤ 0.1 ms	After RESN goes high
Power-on reset (tPOR)	≤ 10 ms	After the supplies are in range

The transfer delay matters on fast SPI peripherals: two frames sent back to back need CSN high for at least 600 ns between them. Init() waits 10 ms with RESN low and 50 ms after release, well above t_RESN.

sequenceDiagram
    participant H as Host (driver)
    participant C as TLE92466ED
    H->>C: frame 1: read 0x0000 (flush)
    C-->>H: reply to whatever came before (discarded)
    H->>C: frame 2: read ICVID (0x0200)
    C-->>H: reply to frame 1 (discarded)
    H->>C: frame 3: read 0x0000 (dummy)
    C-->>H: reply to frame 2: ICVID = 0xC1xx

Each arrow is one CSN low period of 32 bits. SPI protocol explains the frames and why the driver sends three of them per access.

Power

Supply	Functional	Extended	Abs. max
VDD (logic, 5 V input)	4.5 V to 5.5 V	3.5 V to 19 V	19 V
VBAT (battery)	6 V to 18 V	4 V to 38 V	40 V
VIO (SPI output)	3.0 V to 5.5 V	5.5 V to 19 V	19 V
LOADx, FWDx	−0.3 V to 40 V		40 V

Outside the VDD functional range SPI still works but the outputs are off. VBAT is monitored and feeds the diagnosis current sources: reverse-protect and filter it. Select 3.3 V or 5 V VIO monitoring with VIO_SEL (GlobalConfig::vio_5v). Negative pulses on LOADx and FWDx are limited to 2 mJ.

Current	Value	Notes
DC setpoint, per channel	0 mA to 1500 mA	Average current control
Load current including dither	1.8 A
Parallel pair	2.7 A
Absolute maximum, LOADx / FWDx	±2 A DC
Over-current protection threshold	2.05 A to 6 A	Filter time 1.5 µs maximum
Control accuracy	±2.5 mA (10 mA to 250 mA), ±1 % above 250 mA	Single channel, TJ up to 150 °C

Connect the MCU ground to the chip's GND and GNDP pins. Decouple VDD, VIO and VBAT with ceramic capacitors close to the pins.

Thermal

Parameter	Value
Junction temperature	−40 °C to 150 °C (150 °C to 175 °C with parameter deviations)
Over-temperature pre-warning	150 °C to 175 °C
Over-temperature shutdown	175 °C to 200 °C, 10 °C to 15 °C hysteresis
RthJC / RthJA	3 K/W maximum / 18.5 K/W typical (JEDEC 2s2p)

Evaluation kit

Infineon's Next Generation Solenoid Driver evaluation kit has a TLE92466ED evaluation PCB in Arduino form factor (Version S), or the same PCB with a connection PCB for laboratory setups (Version L). The PCB takes 5 V from the MCU board, clocks the chip from an on-board 2 MHz oscillator and brings out SPI, EN, RESN, FAULTN and DRVx on the Arduino headers. The user manual has the connector pinouts and jumpers.

The ESP32 examples run on an ESP32-S3 wired like this (from esp32_tle92466ed_test_config.hpp):

ESP32-S3	TLE92466ED
GPIO36 (SPI3 SCLK)	SCK
GPIO37 (SPI3 MOSI)	SI
GPIO35 (SPI3 MISO)	SO
GPIO4	CSN
GPIO6	RESN
GPIO5	EN
GPIO16 (pull-up)	FAULTN
GPIO7, GPIO15	DRV0, DRV1

Reference documents

Document	What it is for
TLE92466ED datasheet	Pins, electrical limits, SPI protocol, every register
Evaluation kit user manual	Evaluation PCB connectors, jumpers, schematics

Next: Architecture.